TEMSCON 2020 Converting to Virtual Event

The safety and well-being of all conference participants is our priority. IEEE has been monitoring the developing COVID-19 pandemic (Coronavirus).

The World Health Organization has declared COVID-19 (Coronavirus) to be a pandemic, many governments have enacted travel bans and numerous state and local governments are prohibiting large or even moderately-sized public gatherings. Such bans on travel and public gatherings are likely to increase in number and scope in the coming weeks.

After studying and evaluating the announcements, guidance, and news released by relevant national departments, we are sorry to announce that the in-person gathering of TEMSCON 2020, scheduled to be held June 3-6, 2020 in Detroit, Michigan has been cancelled.

TEMSCON 2020 will now be held as a virtual conference, on the same dates.

Information of the virtual platform and program schedule will be announced in the coming days.

Again, we apologize for any inconvenience this has caused and please contact us using the form below with any questions you may have.

IEEE Travel Advisory

COVID-19 Pandemic Advisory from IEEE

As you are likely already aware, the World Health Organization (WHO) has declared COVID-19 to be a pandemic, and now there are many restrictions on travel and in-person convening.

The health and safety of our event participants is of paramount importance to IEEE. We will continue to monitor travel advisories issued by WHO and the Centers for Disease Control (CDC) as well as heed the guidance of local and regional authorities.  We will continue work with our partners at [Venue Name] to remain current on the city’s preparedness to deal with any needs.

Additionally, at this time, the Organizing Committee of TEMSCOM 2020, originally scheduled for June 3-6 is discussing the potential to either postpone, virtually conduct or cancel this year’s event should that become a necessity.  This decision will be reached after carefully considering all available information and consulting with the event’s sponsors.  At this time, we expect to be able to provide an update on our plans on or about May 15.

Travel Booking Guidance

At this time, we encourage you to book a flight that offers a refund or no change fee, or to hold off until a decision is reached. Some airlines may offer refunds if travel is canceled due to the COVID-19 pandemic. Please check with your airline provider for details.

It is unlikely that travel insurance coverage will apply to cancellation of your trip due to the COVID-19 pandemic. This is because the COVID-19 pandemic is no longer an “unexpected event.” Generally, fear of travel is not a covered event under most policies. Please read all travel insurance policies thoroughly.

Travel Guidelines

We urge all travelers to keep informed on risks, precautions, and symptoms to make educated decisions. Travelers can check for updated information on the following sites:


COVID-19 Update

Update: 27-March

The TEMSCON 2020 committee and IEEE have been monitoring the developing COVID-19 pandemic (Coronavirus)

The safety and well-being of all conference participants is our priority. After studying and evaluating the announcements, guidance, and news released by relevant national, state and local departments, we are sorry to announce that TEMSCON 2020, scheduled to be held in Detriot on June 2-5, cannot be held as an in-person event as we originally planned.

We are committed to ensuring that the accepted papers can be presented and published in a timely and safe manner.

We are looking into our options in terms of deferring, postponing or cancellation of of the in-person event at TEMSCON 2020. And our options for virtual presentations. In the meantime, we are continuing to accept and review papers as planned. Submission deadline is 31-March.

We will provide more information on the situation shortly. We thank you for your understanding.

Please check back for the latest status.


Speakers Announced

IEEE Technology and Engineering Management Society’s (TEMS) 2020 International Conference (TEMSCON 2020) will be held at the Embassy Suites by Hilton in Livonia Michigan on June 3-6, 2020. TEMSCON 2020 will bring together 200+ engineering leaders, researchers, educators, innovators, entrepreneurs, and students to gather at the conference to help advance the understanding and the state of practice related to successful technology and engineering management from around the world and focuses on the art and science of management and leadership driving innovation and change. See the Program section of the TEMSCON website for speaking agenda.


Peter Adriaens, PhD PE BCEEM NAE
Director, Center for Smart Infrastructure Finance
Professor of Engineering, Finance and Entrepreneurship
The University of Michigan, Ann Arbor
Amy Gile
CEO of Silverdraft
Anne Y Lee
Technology Strategy and Architecture – Nokia Bell Labs CTO
Tekin Meriçli, Ph.D.
Co-founder and CTO
Locomation, Inc.
Barry L. Shoop
Dean, Albert Nerken School of Engineering, The Cooper Union & Former Director of the Electrical Engineering Program, West Point
Attila Yaprak
Professor of Marketing and International Business
Director, Doctoral Programs and Board of Visitors Faculty Fellow
Mike Ilitch School of Business
Wayne State University

Experience the new Detroit when you attend TEMSCON 2020!

Detroit had its best, its worst and now is enjoying its new best again. Regardless whether you are presenting or just attending TEMSCON, take advantage of the fact that you are in Detroit, to ponder its history and its vision for the future.

On July 18, 2013, the City of Detroit filed bankruptcy protection, became the largest U.S. city that went bankrupt. Once the symbol and pride of American manufacturing, Detroit suffered from high crime, a high unemployment rate, high number of empty buildings and large debt. It was regarded as the most miserable city in the U.S.

Now, less than five years from bankruptcy, Fortune and Forbes have started to call Detroit “The Next Silicon Valley.” What caused such dramatic transformation?

Photo of Detroit Car Assembly Lines, Wikimedia

Let’s take a short history review:


Call for Papers

TEMSCON 2020 Call for Papers

Submission Deadline Extended to 31 Mar 2020



The greater Detroit area has a long history as a hub for engineering and manufacturing automobiles. With the ever accelerating progress on innovation and a push for market-ready automated, connected and electrified vehicles, Detroit remains the heart of the automotive industry. Southeast Michigan has also diversified its economic base in emerging technology areas including information technology, health care and biomedical, power and energy, advanced manufacturing, and higher education and research. We invite contributions from engineering leaders, researchers, educators, innovators, entrepreneurs, and students to help advance the understanding and the state of practice related to successful technology and engineering management. Contributions may be research or practical. Research papers may be conceptual, empirical, or theoretical, but they must discuss how the results could be applied in practice. Practice-focused papers may consist of case studies, description of best practices, or application experiences, but they should also shed light on new challenges and unresolved future issues, which could be addressed by the research community. We thus provide a venue where different points of view interact to yield new understanding and ideas on leading innovation as well as the future of technology and engineering management. Selected papers will be invited to submit to the IEEE Engineering Management Review or IEEE Transactions on Engineering Management.

Key dates:

  • Paper Submissions Due: 29 Feb 2020 31 Mar 2020
  • Notification of Acceptance: March 28, 2020 (for papers submitted by Feb. 29); mid-April for later papers.
  • Revisions Due (For Papers Requiring Revisions): 18 Apr 2020
  • Final Papers Due: 2 May 2020
  • Note: Acceptance to present at TEMSCON 2020 will be based on a full-paper review (not an abstract review)

Topic areas include, but are not limited to, the following:

* Innovating in rapidly changing markets, e.g. biotech and health care and manufacturing
* Leading and managing innovation and transformation
* Managing in-vehicle software versions and interoperability among the different vehicle ages & brands
* Adopting new technologies: challenges and risk mitigation
* Understanding trends and applicability of new technologies
* Leveraging enterprise data, e.g., successful use of AI, analytics, blockchain and IoT
* Leading societal change, e.g., mobility, intelligent transportation, healthcare and public policy
* Enhancing industry, university, and/or government collaboration
* Developing personal skills for leading innovation initiatives

In addition, we invite proposals for half-day workshops, including special sessions from other technical societies, related to the conference theme.

Industry perspectives will be featured throughout the meeting via panels and plenary talks.