WIE Partners with TEMSCON 2020 Industry Forum

Detroit Jan. 6, 2020:

We are excited to announce that the IEEE Women In Engineering Leadership Summit (WIELS) will join TEMSCON 2020 Industry Forum on Thursday June 4.  Innovation, Leadership, Management of Technology as well as entrepreneurship are key focus areas for IEEE WIE as more and more women are getting into STEM and becoming leaders and inventors. TEMS Engineering Management Review featured a series of articles and interviews with women CEOs and Innovators in late 2019. This jointly hosted event will bring all parties together in the field of technology management to exchange views and share common concerns in the digital world continuously led by Connectivity, AI, Machine Learning and Blockchain.

IEEE WIE: wie.ieee.org


Experience the new Detroit when you attend TEMSCON 2020!

Detroit had its best, its worst and now is enjoying its new best again. Regardless whether you are presenting or just attending TEMSCON, take advantage of the fact that you are in Detroit, to ponder its history and its vision for the future.

On July 18, 2013, the City of Detroit filed bankruptcy protection, became the largest U.S. city that went bankrupt. Once the symbol and pride of American manufacturing, Detroit suffered from high crime, a high unemployment rate, high number of empty buildings and large debt. It was regarded as the most miserable city in the U.S.

Now, less than five years from bankruptcy, Fortune and Forbes have started to call Detroit “The Next Silicon Valley.” What caused such dramatic transformation?

Photo of Detroit Car Assembly Lines, Wikimedia

Let’s take a short history review:


Speakers Announced

Speakers Announced: TEMSCON 2020, June 3-6, 2020, Detroit

IEEE Technology and Engineering Management Society’s (TEMS) 2020 International Conference (TEMSCON 2020) will be held at the Embassy Suites by Hilton in Livonia Michigan on June 3-6, 2020. TEMSCON 2020 will bring together 200+ engineering leaders, researchers, educators, innovators, entrepreneurs, and students to gather at the conference to help advance the understanding and the state of practice related to successful technology and engineering management from around the world and focuses on the art and science of management and leadership driving innovation and change.

We have an impressive list of 15+ speakers who have made the commitment to present at our conference to share their experience and views. View the details here.

Reserve the date to join us in Detroit June 3-6, 2020!


Call for Papers

TEMSCON 2020 Call for Papers

The greater Detroit area has a long history as a hub for engineering and manufacturing automobiles. With the ever accelerating progress on innovation and a push for market-ready automated, connected and electrified vehicles, Detroit remains the heart of the automotive industry. Southeast Michigan has also diversified its economic base in emerging technology areas including information technology, health care and biomedical, power and energy, advanced manufacturing, and higher education and research. We invite contributions from engineering leaders, researchers, educators, innovators, entrepreneurs, and students to help advance the understanding and the state of practice related to successful technology and engineering management. Contributions may be research or practical. Research papers may be conceptual, empirical, or theoretical, but they must discuss how the results could be applied in practice. Practice-focused papers may consist of case studies, description of best practices, or application experiences, but they should also shed light on new challenges and unresolved future issues, which could be addressed by the research community. We thus provide a venue where different points of view interact to yield new understanding and ideas on leading innovation as well as the future of technology and engineering management. Selected papers will be invited to submit to the IEEE Engineering Management Review or IEEE Transactions on Engineering Management.

Key dates:

  • Paper Submissions Due: 29 Feb 2020
  • Notification of Acceptance: 28 Mar 2020
  • Revisions Due (For Papers Requiring Revisions): 18 Apr 2020
  • Final Papers Due: 2 May 2020

Topic areas include, but are not limited to, the following:

* Innovating in rapidly changing markets, e.g. biotech and health care and manufacturing
* Leading and managing innovation and transformation
* Managing in-vehicle software versions and interoperability among the different vehicle ages & brands
* Adopting new technologies: challenges and risk mitigation
* Understanding trends and applicability of new technologies
* Leveraging enterprise data, e.g., successful use of AI, analytics, blockchain and IoT
* Leading societal change, e.g., mobility, intelligent transportation, healthcare and public policy
* Enhancing industry, university, and/or government collaboration
* Developing personal skills for leading innovation initiatives

In addition, we invite proposals for half-day workshops, including special sessions from other technical societies, related to the conference theme.

Industry perspectives will be featured throughout the meeting via panels and plenary talks.