COVID-19 Update

Update: 27-March

The TEMSCON 2020 committee and IEEE have been monitoring the developing COVID-19 pandemic (Coronavirus)

The safety and well-being of all conference participants is our priority. After studying and evaluating the announcements, guidance, and news released by relevant national, state and local departments, we are sorry to announce that TEMSCON 2020, scheduled to be held in Detriot on June 2-5, cannot be held as an in-person event as we originally planned.

We are committed to ensuring that the accepted papers can be presented and published in a timely and safe manner.

We are looking into our options in terms of deferring, postponing or cancellation of of the in-person event at TEMSCON 2020. And our options for virtual presentations. In the meantime, we are continuing to accept and review papers as planned. Submission deadline is 31-March.

We will provide more information on the situation shortly. We thank you for your understanding.

Please check back for the latest status.

 

Speakers Announced

IEEE Technology and Engineering Management Society’s (TEMS) 2020 International Conference (TEMSCON 2020) will be held at the Embassy Suites by Hilton in Livonia Michigan on June 3-6, 2020. TEMSCON 2020 will bring together 200+ engineering leaders, researchers, educators, innovators, entrepreneurs, and students to gather at the conference to help advance the understanding and the state of practice related to successful technology and engineering management from around the world and focuses on the art and science of management and leadership driving innovation and change. See the Program section of the TEMSCON website for speaking agenda.

 

Peter Adriaens, PhD PE BCEEM NAE
Director, Center for Smart Infrastructure Finance
Professor of Engineering, Finance and Entrepreneurship
The University of Michigan, Ann Arbor
Amy Gile
CEO of Silverdraft
Anne Y Lee
Technology Strategy and Architecture – Nokia Bell Labs CTO
Tekin Meriçli, Ph.D.
Co-founder and CTO
Locomation, Inc.
Barry L. Shoop
Dean, Albert Nerken School of Engineering, The Cooper Union & Former Director of the Electrical Engineering Program, West Point
Attila Yaprak
Professor of Marketing and International Business
Director, Doctoral Programs and Board of Visitors Faculty Fellow
Mike Ilitch School of Business
Wayne State University

Experience the new Detroit when you attend TEMSCON 2020!

Detroit had its best, its worst and now is enjoying its new best again. Regardless whether you are presenting or just attending TEMSCON, take advantage of the fact that you are in Detroit, to ponder its history and its vision for the future.

On July 18, 2013, the City of Detroit filed bankruptcy protection, became the largest U.S. city that went bankrupt. Once the symbol and pride of American manufacturing, Detroit suffered from high crime, a high unemployment rate, high number of empty buildings and large debt. It was regarded as the most miserable city in the U.S.

Now, less than five years from bankruptcy, Fortune and Forbes have started to call Detroit “The Next Silicon Valley.” What caused such dramatic transformation?

Photo of Detroit Car Assembly Lines, Wikimedia

Let’s take a short history review:

(more…)

Call for Papers

TEMSCON 2020 Call for Papers

Submission Deadline Extended to 31 Mar 2020

 

 

The greater Detroit area has a long history as a hub for engineering and manufacturing automobiles. With the ever accelerating progress on innovation and a push for market-ready automated, connected and electrified vehicles, Detroit remains the heart of the automotive industry. Southeast Michigan has also diversified its economic base in emerging technology areas including information technology, health care and biomedical, power and energy, advanced manufacturing, and higher education and research. We invite contributions from engineering leaders, researchers, educators, innovators, entrepreneurs, and students to help advance the understanding and the state of practice related to successful technology and engineering management. Contributions may be research or practical. Research papers may be conceptual, empirical, or theoretical, but they must discuss how the results could be applied in practice. Practice-focused papers may consist of case studies, description of best practices, or application experiences, but they should also shed light on new challenges and unresolved future issues, which could be addressed by the research community. We thus provide a venue where different points of view interact to yield new understanding and ideas on leading innovation as well as the future of technology and engineering management. Selected papers will be invited to submit to the IEEE Engineering Management Review or IEEE Transactions on Engineering Management.

Key dates:

  • Paper Submissions Due: 29 Feb 2020 31 Mar 2020
  • Notification of Acceptance: March 28, 2020 (for papers submitted by Feb. 29); mid-April for later papers.
  • Revisions Due (For Papers Requiring Revisions): 18 Apr 2020
  • Final Papers Due: 2 May 2020
  • Note: Acceptance to present at TEMSCON 2020 will be based on a full-paper review (not an abstract review)

Topic areas include, but are not limited to, the following:

* Innovating in rapidly changing markets, e.g. biotech and health care and manufacturing
* Leading and managing innovation and transformation
* Managing in-vehicle software versions and interoperability among the different vehicle ages & brands
* Adopting new technologies: challenges and risk mitigation
* Understanding trends and applicability of new technologies
* Leveraging enterprise data, e.g., successful use of AI, analytics, blockchain and IoT
* Leading societal change, e.g., mobility, intelligent transportation, healthcare and public policy
* Enhancing industry, university, and/or government collaboration
* Developing personal skills for leading innovation initiatives

In addition, we invite proposals for half-day workshops, including special sessions from other technical societies, related to the conference theme.

Industry perspectives will be featured throughout the meeting via panels and plenary talks.