Important Dates

Paper Submission Due:
31 January 2017
Notification of Acceptance:
15 February 2017

Author Registration Due:
15 May 2017

Normal Registration/
Hotel Block Deadline:
1 May 2017

Late Registration Begins:
15 May 2017

Welcome to IEEE TEMSCON 2017!

The 1st Annual International Conference of the IEEE Technology and Engineering Management Society

June 8-10, 2017

Santa Clara Convention Center

Silicon Valley (Santa Clara), California USA

Dear Participants of TEMSCON 2017,

TEMSCON 2017 is the inaugural flagship conference of the IEEE Technology and Engineering Management Society (TEMS) and will be an Annual Conference. This conference provides studies on the concepts, theories, and best practices in the field of technology management. For technology and engineering this addresses the methodologies required to move technical ideas to market.

In today’s technology world the engagement steps to move a stimulating technical concept into a marketable product has many challenges and requires broad understanding of technical and business practices. This is true in an entrepreneurship environment, where a startup is creating a business as well in an intrapreneurship, where steps are within an existing company. Our event addresses these areas including innovation, engineering management, marketing, manufacturing, supply chain, and people matters. Requirements and processes for new technologies are also studied including IT, Internet, IoT, Biotech, healthcare, and social media. Expected papers document research activities, case studies and best practices. The conference is designed to be valued by the engineering, business, and management communities.

TEMSCON 2017 will include an Industry Forum session where senior Industry speakers from Intel, Facebook, Uber, etc. will present their visions, directions and challenges in technology management in today’s modern companies. In addition, it will have educational programs for students and young professionals as well as an Editor’s Panel. The conference will take place in Silicon Valley, the center of high tech innovation and development with industries spanning all areas of the world. It will begin with a panel of executives from four distinctly different companies in four different markets, but each creatively and effectively managing the fast paced change in technology, market opportunity, and internal management. Each will provide a short description of how they view the issues in their markets and present a brief case study to illustrate the practices they employ to successful manage and lead, followed by a discussion with the audience.

Panel Speakers:

  • Scott Fouse, VP Lockheed Martin Advanced Concepts Lab
  • Julie Black, CTO, Evidation
  • John Avery, Panasonic Automotive Innovation Center
  • TBD, Cisco
Finally, there will be an opportunity to publish in a Special Issue of our journal IEEE Transaction on Engineering Management for selected papers submitted to the conference.

We look forward to seeing you at 2017 IEEE TEMSCON in Silicon Valley!

Michael W. Condry, TEMS President-Elect 2016-2017 and TEMSCON 2017 General Chair

Robert Bierwolf, TEMS Vice-President of Conferences and TEMSCON 2017 General Co-Chair